Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Hub350 RBCx Finance Quarter 350 Legget Dr, Kanata, Ontario, CanadaDr. John H. Lau, a world-renowned expert in semiconductor packaging with over 530 publications, 52 patents, and 23 textbooks, is visiting our IEEE chapter to deliver a must-attend seminar on: […]